HYPREZ® Lapping & Polishing Machines and Accessories
Engis is a global leader in the design and manufacture of complete lapping and polishing systems that offer the highest quality finished components, processed in the quickest cycle times, while keeping your manufacturing costs at a minimum. But the machine is just one part of the puzzle….what really sets us apart from the competition is our unique ability to provide Process Development and Customer Support that is second to none.
Machines:
FastLap Lapping & Polishing Machines
Lapping Plate Facing/Grooving Device
HVG Precision Grinding Machines
Accessories:
Slurry Mixing/Dispensing Systems
Hyprez Lapping Plates
Hyprez Conditioning & Work Rings
Part Carriers and Mounting Accessories
Maintaining a flat and evenly textured composite lap plate is critical for stable lapping performance. Traditionally this is achieved with a diamond plated conditioning ring, requiring a high level of operator experience and skill. To improve this process, Engis has engineered a solution that helps take the ‘art’ out of lapping, the Facing/Grooving Device.
Using a diamond tool bit, this innovative device removes the top layer of the composite plate, making it flat to within microns. A groove pattern can be machined in a second pass. It is even possible to create a tapered plate to produce slightly convex/concave surfaces. When the device is not in use, it retracts out of the work zone.
Consistent plate shape (flat or tapered)
Long lasting, consistent plate texture
Increased stock removal rate
Improved lapping performance stability
Improved ergonomics, no need to lift heavy rings
Hyprez® FastLap Lapping & Polishing Machines
36FL115VP FastLap Lapping & Polishing MachineThe FastLap Series of Lapping & Polishing Machines are built for versatility and speed. These machines can be customized from a basic tabletop model to a large floor-standing model with advanced process controls.
Built with heavy duty spindle bearings, they are designed to withstand the high loads necessary for diamond processing of hard materials.
| FastLap Standard Machine Models (additional sizes available) | |||||||
|---|---|---|---|---|---|---|---|
| Standard Models | FL15 | FL20 | FL24 | FL28 | FL36 | FL42 | FL48 |
| Lap Plate Diameter | 15″ 381 mm | 20″ 508 mm | 24″ 610 mm | 28″ 711 mm | 36″ 914 mm | 42″ 1067 mm | 48″ 1219 mm |
| Maximum part Diameter (inside work ring) | 5-7/16″ 138 mm | 7-7/16″ 188 mm | 9-11/16″ 246 mm | 11-15/16″ 303 mm | 14-7/16″ 366 mm | 16-15/16″ 430 mm | 16-15/16″ 430 mm |
| Work Stations/Rings | 3 | 3 | 3 | 3 | 3 or 4 | 3 or 4 | 3 or 4 |
| Maximum Plate Speed | 90 rpm | 90 rpm | 90 rpm | 90 rpm | 70 rpm | 70 rpm | 50 rpm |
| Maximum Pneumatic pressure (per spindle, all spindles engaged) | 100 lbs 45 kg | 200 lbs 90 kg | 300 lbs 136 kg | 500 lbs 227 kg | 1100 lbs 499 kg | 1100 lbs 499 kg | 1600 lbs 725 kg |
| Built-In Machine Options | ||
|---|---|---|
| Basic | Advanced | |
| Controls | Digital | Touch-Screen PLC |
| Pressure | Hand Weight | Pneumatic |
| Work Ring Rotation | Yoke/Roller | Power Assist or Direct Drive |
| Lap Plate Control | Plated Conditioning Ring | Facing/Grooving Device |
| Slurry Control | External (EMC-3) | Integrated with PLC |
| Automated Thickness Control | – | Integrated with PLC |
| Materials | Cast iron/aluminum | SUS table, trough, pressure plates |
| Low Pressure Option | – | Counterbalance |
| Temperature Control | – | Water cooled drive wheel |
| Temperature Monitoring | – | 3 location sensor over plate |
| Torque Monitoring/Control | – | With optional cut-off |
| Environmental Control | – | Workspace enclosure |
| Recipe Storage | – | Up to 100 |
| Data Capture/Barcode Scanning | – | User specified |
High Precision Vertical Wafer Grinding Machines
The HVG Series Vertical Wafer Grinding Machine is designed to grind advanced materials to a high degree of precision in flatness and surface quality, often reducing or eliminating the need for lapping. The compact design with advanced controls and process monitoring makes this an ideal machine for use in research & development or for low volume production of advanced components.
Hyprez® Slurries
Hyprez® Lapping and Polishing Slurries
As part of our complete solution, Engis manufactures a complete line of precision graded diamond slurries or aluminum oxide powder with lapping oil for achieving flatness control and excellent surface finish on a wide variety of materials.
Why diamond?
- Reduce lapping times from hours to minutes
- Reduce slurry usage and waste from gallons to pints
- Achieve a reflective finish in a single step, eliminate hand polishing
- Cleaner process, cleaner parts
- Process a wide variety of materials
Why Engis?
- Engis is a micronizer – we purify, precision grade, disperse, and custom formulate our slurries, where others are simply repackaging. We are unequaled in our ability to precisely characterize and control particle size distributions (PSD).
- Applications expertise – our engineers can provide the full process recommendation for your part/material – not only the best slurry formulation but also the polishing machine, lap plate or pad, accessories, and process settings.
Engis Diamond Slurries
Engis provides a broad range of diamond slurry formulations; our standard formulations are shown in the table below. Custom formulations are available. Simply choose your formulation and specify:
- Diamond type (polycrystalline, monocrystalline)
- Diamond size (available from 50 nm to 60 micron)
- Package size (pints, quarts, gallons)
Our experts are happy to guide your choice of slurry based on your application, material, and requirements.
| Slurry Formulations | Water Soluble | Oil Based | Emulsion | Low Viscosity (<10 cP) | Med Viscosity (10 – 100 cP) | High Viscosity (permanent Suspension) | Only Non-Haz Components |
|---|---|---|---|---|---|---|---|
| S4243 | ✔ | ✔ | |||||
| S7459-2 | ✔ | ✔ | |||||
| S4889 | ✔ | ✔ | |||||
| ECOLAP 2000 | ✔ | ✔ | ✔ | ||||
| S1313-T4 | ✔ | ✔ | |||||
| ECOLAP 1001 | ✔ | ✔ | ✔ | ||||
| S841 | ✔ | ✔ |
Aluminum Oxide powder with Lapping Oil
- Low cost and recyclable
- Used for achieving matte finish
- Powder sizes from 5 – 50 micron
Hyprez Lap Plates
Engis manufactures a complete line of lap plates, including metal composite, solid metal, and fixed abrasive options. Our applications experts can recommend the best lap plate for your application.
An efficient lapping operation requires the selection of a proper lap plate. This selection is guided by the process objective (stock removal, fine finish), the material being lapped, and the diamond size/type used in the lapping slurry.
A composite lap plate is comprised of metal or ceramic particles in a resin matrix, allowing for efficient charging of diamond abrasive particles into the plate. This charged composite plate can significantly reduce process times and achieve a finer surface finish, often in a single step. A composite plate is also well suited for a facing device, taking the guess work out of flatness and texture control.
Hyprez® X08
Composite Iron plate with most aggressive stock removal; good alternative to cast iron
Hyprez®C250
Composite copper plate; our most universal plate, often used for single step operations
Hyprez®X100
Composite aluminum plate; good substitute for C250 when copper contamination is a concern
Hyprez® TX-10A
Composite tin plate; very fine finish, minimizes or replaces pad polishing to maintain flatness
Hyprez® HY Ceramic
Composite ceramic plate; used when metal free processing is required
Hyprez® Composite plate configurations
- Sizes from 1″ to 100″ OD
- Available mounted to a solid metal base, or unmounted with mounting kit
- Wide range of grooving options: concentric, radial, spiral, square, custom
Hyprez Diamond Compound
Engis originally developed its precision diamond compound to improve gyroscopes for navigation systems in 1940s aircraft. Now, with more than 80 years of experience, Engis is a world leader in the manufacture of high-quality diamond compound, offering the widest range of products in the industry.
Hyprez Diamond Compound is available in pastes, gels, and pourable/pumpable options, depending on user needs. All options are available in diamond sizes ranging from 0.1 – 60 microns, with precision graded mono- or polycrystalline diamond. An Engis application engineer can assist you in selecting the best product for your application.
Diamond Pastes
Diamond pastes are thick formulations, dispensed from a syringe or jar and manually spread across the part. Pastes are the most commonly used form of diamond compound for hand polishing, and they are used with a companion lubricant.
| Compound Type | L | W | FiveStar (FS) |
|---|---|---|---|
| Solubility | Oil | Water | Universal (Oil/Water) |
| Companion Lubricant | OS-IV | W Lubricant | OS-IV or W |
| Compound Package Options | Syringe(5,18,50,100 gram), Hyplicator®(10 gram) or Jar(100, 5000 gram) | ||
Diamond Gels
Diamond gels are thinner than pastes, but still thick enough to be applied with a syringe. The thinner consistency results in slower drying, reducing scratching on larger parts while maintaining good adhesion to lapping tools and parts. Great for automated or hand polishing.
| Compound Type | L-GEL | W-GEL |
|---|---|---|
| Solubility | Oil | Water |
| Companion Lubricant | OS-IV | W Lubricant |
| Compound Package Options | Syringe(18,100 gram) | |
Flowable Compounds
Flowable compounds can be poured or pumped for applications using automated polishing. The thick formulation will flow around the part while maintaining good adhesion.
| Compound Type | L-FLO | W-FLO |
|---|---|---|
| Solubility | Oil | Water |
| Companion Lubricant | OS-IV | W Lubricant |
| Compound Package Options | Pint bottle(400gram) | |
*Engis can customize other packaging types and unit sizes to meet your production requirements
Our systems are suitable for processing a vast range of materials: metals, ceramics, glass, semiconductor substrates, plastics and other advanced materials. We have developed solutions for many industries, improving quality, efficiency, and cost. If you don’t see your industry, please contact us.
Semiconductor Surface Technology with our Hyprez Polishing Pads
The production of an exacting surface finish on silicon or other semiconductor crystals has become more demandingand it has become highly critical to meet the requirements of today’s semiconductor industry. At Hyprez we strive to meet the ever-changing needs of the industry. We offer various polishing pad types depending on your final polishing requirements and characteristics. We offer surface roughness, removal rat, and edge rounding options. See our selection:
PM-700-Microcell pad made from buffed polyurethane with microscopic voids, laminated to non-woven.
PM-710– Microcell pad made from buffed polyurethane with microscopic voids, laminated to non-woven.
HY NAP700- Nap/flock pad made with long viscose fibers.
HY NAP 730 –Nap/flock pad made with long viscose fibers on the woven substrate.
HY NAP 780– Nap/flock pad made with thin, short viscose fibers on the woven substrate.
HY NAP 800 –Nap/flock pad made with short viscose fibers on the woven substrate.
HLM 4F– Woven, low cost for metal polishing.
HS-4/SU– Rigid non-woven impregnated with polyurethane.
ATP 600-Thick non-woven made from polyester/polypropylene fibers with a buffed surface.
Helical ID & OD Lapping Tools
Internal Laps,
Arbors, &
Expanders
Expanding Cast Iron Laps for Precise Bore Geometry & Micro Finishes
External Laps &
Lap Holders
Cast Iron External Laps & Lap Holders
Abrasives
High Quality Lapping Compounds for Superior Finishes.
Hand Lapping Plates
Precision Ground Cast Iron for Achieving Flatness
Special Application Lapping
Tools
Blind Bores, Step and Tandem Laps, & Special Sizes.
Tool Fundamentals
Helpful Information About Using Our Tools
Hyprez Lapping & Polishing Complete
Hyprez® Lapping & Polishing
Facing & Grooving
Fastlap Machines
HVG Grinder Series
Hyprez® Slurries
Hyprez® Lapping Plates
Hyprez® Diamond Compound
Lapping & Polishing Industries
Hyprez Polishing Pads
Helical ID & OD Lapping Tools
